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■ PRECAUTIONS
Precautions on the use of Multilayer chip varistors.
5. Cleaning
◆ Cleaning conditions
Precautions
Technical
consider-
ations
1. When cleaning the PC board after the varistors are all mounted, select the appropriate cleaning solution according to the type of ?ux used and purpose of the
cleaning (e.g. to remove soldering ?ux or other materials from the production process.)
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the varistor's characteristics.
◆ Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as ?ux residue to adhere to the varistor or deteriorate the varistor's outer coating,
resulting in a degradation of the varistor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions (insuf ?cient or excessive cleaning) may detrimentally affect the performance of the varistors.
（ 1 ） Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the varistor or
the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;
Ultrasonic output : Below 20W/ ?
Ultrasonic frequency
: Below 40kHz
Ultrasonic washing period : 5 min. or less
6. Post cleaning processes
◆ Application of resin coating, molding, etc. to the PCB and components
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal
Precautions
storage conditions resulting in the deterioration of the varistor's performance.
2. When a resin's hardening temperature is higher than the varistor's operating temperature, the stresses generated by the excess heat may lead to varistor
damage or destruction. The use of such resins, molding materials etc. is not recommended.
7. Handling
◆ Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting varistors and other components, care is required so as not to give any stresses of de?ection or twisting to the
board.
Precautions
2. Board separation should not be done manually, but by using the appropriate devices.
◆ Mechanical considerations
1. Be careful not to apply excessive mechanical shocks to the varistors.
（ 1 ） If ceramic varistors are dropped onto the ?oor or a hard surface, they should not be used.
（ 2 ） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
◆ Storage
1. To maintain the solder ability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and
Precautions
Technical
consider-
ations
humidity in the storage area. Humidity should especially be kept as low as possible.
? Recommended conditions
Ambient temperature : Below 40 ℃
Humidity : Below 70% RH
The ambient temperature must be kept below 30 ℃ . Even under ideal storage conditions varistor electrode solderability decreases as time passes, so
should be used within 6 months from the time of delivery.
? Ceramic chip varistors should be kept where no chlorine or sulfur exists in the air.
◆ Storage
1. If the parts are stored in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If ex-
ceeding the above period, please check the solderability before using the varistors.
＊ This catalog contains the typical speci ?cation only due to the limitation of space. When you consider the purchase of our products, please check our speci ?cation.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
chipv0102_reli-PRP6
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